Module 1: Industry Roadmap & Advanced Packaging
Industry Roadmap & Advanced Packaging
Limited Seats Available
2.5 Days ✦ In-Person Workshop ✦ 4-6 Dec. 2026
Advanced Semiconductor
Packaging Reliability Workshop
Venue: IIT Alumni Centre, Bengaluru
About the Workshop
India’s packaging plants are coming online, and every new line needs engineers who can prove a package will last. This intensive, in-person programme covers quality, qualification and reliability for advanced packages, chiplets and AI hardware from industry roadmaps to accelerated stress testing, Weibull statistics and design-for-reliability.
The programme is led academically by IIT Kharagpur, India’s first IIT, founded in 1951. Every participant who completes all sessions and exercises receives a Certificate of Completion from IIT Kharagpur.
Dr. Shalabh Tandon
Former Senior Director, Quality and Reliability, Intel ✦ Co-founder, QuRIuS LLC, Chandler
Dr. Shalabh Tandon rose from reliability engineer to Senior Director over 27 years in Intel’s high-volume manufacturing, spanning all four Q&R domains: package, product, test and platform. He led product quality and reliability for Intel’s IoT business, resolving critical issues with functional, security and supply-chain impact. A trusted adviser to senior executives, technical fellows and customers, he has published on package interface strength, packaging analytics, and ADAS packaging and cooling. PhD, Polymer Science and Engineering, UMass Amherst.
Faculty Interaction
Ms. Shubhada Sahasrabudhe
Former Principal Engineer, Quality and Reliability, Intel ✦ Co-founder, QuRIuS LLC, Chandler, Arizona
Ms. Shubhada Sahasrabudhe, former Principal Engineer, Quality and Reliability, Intel (2001–2024), co-founded QuRIuS LLC, Chandler, Arizona. A senior leader in product quality, innovation and technology, she shaped industry-wide quality strategy with data-centre leaders and co-authored Intel–Meta work on silent data corruption at scale. An expert in quality modelling, test methods and customer quality, she has 9 patents and 30+ publications, co-chairs the IEEE Heterogeneous Integration Roadmap Reliability Chapter, and won ASME’s 2021 Woman in Engineering award. MS, University of Maryland.
Faculty Interaction
Prof. Anandaroop Bhattacharya
✦ Program Coordinator
Prof. Anandaroop Bhattacharya is Dean, International Relations, and Prem Prakash Verma Chair Professor, Mechanical Engineering, at IIT Kharagpur. He spent 12 years in industry at Intel, General Motors and GE research centres. An ASME and INAE Fellow with 26 issued/pending patents and ~75 publications, he teaches IIT Kharagpur’s NPTEL course on Electronic Packaging and Manufacturing. PhD, University of Colorado Boulder.
From Roadmap to Field: Six Modules to Prove a Package Will Last
Module 2: Fundamentals of Quality & Reliability
Bathtub curve, cost of failure, and DPM and lifetime goals set from customer needs.
Module 3: Q&R Across the Product Lifecycle
Concept to field deployment, and standards-based versus knowledge-based qualification.
Module 4: Reliability Evaluation - Part 1
Use conditions, accelerated stress tests, failure mechanisms and failure analysis.
Module 5: Reliability Evaluation - Part 2
Weibull and lognormal statistics, acceleration models and use condition DPM.
Module 6: Design & Manufacturing for Reliability
DfR, MfR, SPC, field telemetry and critical-issue management.
The Program Runs from Friday Afternoon to Sunday
Friday 4 December, Afternoon
✦ Welcome and Introductions ✦ Module 1 ✦ Networking high tea
Saturday 5 December, Full Day
✦ Module 2 and 3 ✦ Module 4 ✦ Hands-on excersice
Sunday 6 December, Full Day
✦ Module 5 and 6 ✦ Hands-on excersice ✦ Closing and Certificates
Built for Engineers Who Own Package Quality
✦ Package and assembly engineers ✦ Product and test engineers ✦ Quality and reliability engineers ✦ Failure analysis engineers ✦ Supplier and customer quality managers ✦ Chiplet and heterogeneous integration designers ✦ Engineering and programme managers
Semiconductor design and product engineering
OSAT and ATMP units
Electronics manufacturing services
Automotive, aerospace and data-centre hardware
Earn a Certificate of Completion from IIT Kharagpur
Awarded to every participant who completes all sessions and exercises, presented at the closing on Sunday.
Why Engineers Choose This Workshop
100% Practitioner-Led with Hands-On Exercises
Every session is delivered by former Intel quality and reliability leaders.
AI Product Specification & Behaviour Design
2.5D/3D packages now set performance; reliability protects the value of costly silicon.
Statistics You Can Defend
Weibull and lognormal models, acceleration models and use-condition DPM, worked hands-on.
Qualification Beyond the Checklist
Standards-based and knowledge-based qualification across the product lifecycle.
A Framework for Critical Issues
Learn from the authors of the 9-6 framework for resolving product issues consistently.
Led by IIT Kharagpur
IIT Kharagpur leads the programme academically and awards the Certificate of Completion.
Did you know?
In 2026, Micron’s Sanand assembly and test plant began operations and Kaynes Semicon started commercial OSAT production. Every new line needs engineers who can prove a package will last.
IIT Alumni Centre Bengaluru
✦ Built by all 23 IITs and recognised by the Ministry of Education ✦ 93,000 sq ft centre in the Electronic City area, opened in 2023 ✦ Classroom halls with tables, large screens and full sound
Programme Fee
Standard
75,000
What You Get:
Includes faculty sessions, course material, meals on all days, the venue and the IIT Kharagpur certificate.
Accommodation and travel are not included.
Fee (Inclusive of GST)Eligibility: Minimum 3 years of work experience
Our Admission Process
Secure your seat in three easy steps. Registrations close 30 November.
- 1
Fill in your details and submit the application
- 2
Profile review for relevant industry experience
- 3
Pay the fee and block your seat